High-Rate Epitaxial Growth of Silicon Using Electron Beam Evaporation at High Temperatures

This paper describes the high-rate (~1.5 μm/min) growth of Si films on Si supporting substrates with (100) crystallographic orientation at 600 °C, 800 °C, and 1000 °C in a vacuum environment of ~1 × 10−5 mbar using electron beam (e-beam) evaporation. The microstructure, crystallinity, and conductivity of such films were investigated. It was established that fully crystalline (Raman spectroscopy, EBSD) and stress-free epi-Si layers with a thickness of approximately 50 µm can be fabricated at 1000 °C, while at 600 °C and 800 °C, some poly-Si inclusions were observed using Raman spectroscopy. Hall effect measurements showed that epi-Si layers deposited at 1000 °C had resistivity, carrier concentration, and mobility comparable to those obtained for c-Si wafers fabricated through ingot growth and wafering using the same solar grade Si feedstock used for the e-beam depositions. The dislocation densities were determined to be ∼2 × 107 cm−2 and ∼5 × 106 cm−2 at 800 and 1000 °C, respectively, using Secco etch. The results highlight the potential of e-beam evaporation as a promising and cost-effective alternative to conventional CVD for the growth of epi-Si layers and, potentially, epi-Si wafers. Some of the remaining technical challenges of this deposition technology are briefly indicated and discussed.