Abstract 6‐Amino‐2‐( p ‐aminophenyl) benzimidazole (BIA) was synthesized and empolyed as a diamine component in the preparation of polyamic acid. The mechanical and thermal properties of polyimides made from BIA as a diamine component were investigated. A highadhesion, curl‐free polyimide/copper laminate has been obtained by using BIA as a diamine component.
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Chen et al. (1994) studied this question.
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