It is well known that intrinsic stress plays an important role in the superconducting material properties of niobium (Nb) thin films and in the resulting electrical characteristics of superconducting-insulating-superconducting (SIS) junctions made from these films. The role of sputtering pressure, gun operating parameters and substrate fixturing on Nb film stress has been investigated by a number of researchers. In this paper we discuss the role of wafer preparation on the stress of Nb thin films. We have found that ex-situ substrate cleaning and baking as well as in-situ cleaning and deposition sequencing have a significant effect on the resulting measured film stress.
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Bass et al. (2003) studied this question.
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