The solvent and solute enhancement factors in Cu(Sn) alloys are studied for Sn concentrations up to 2.86 at% in the temperature ranges of 797.3 to 921.4 °C and of 759.4 to 908.4 °C, respectively. The calculated enhancement factors are bCu1 = 56.5 to 38.0 and bCu2 = 3893 to 2349 for solvent diffusion and bSn1 = 35.8 to 37.8 for solute diffusion in the corresponding temperature ranges. In order to determine the correlation factor, f2, of impurity diffusion a modified method is proposed. The resulting correlation coefficients are f2 = 0.31 at T = 797.3 °C and f2 = 0.46 at T = 921.4 °C.
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Reinhold et al. (1980) studied this question.
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