Answers are grounded in this paper and cite their sources.
Secondary ion mass spectroscopy was used to measure phosphorus concentration profiles in TaSi2 thin films deposited on P doped polycrystalline Si/SiO2/Si wafers by cosputtering. Fast redistribution of P in TaSi2 takes place by its up-diffusion from the polycrystalline Si layer. Radioactive assay of 32P obtained by neutron activation confirmed the fast-diffusion character of P in TaSi2. From preliminary results the temperature dependence of the diffusion coefficients over the temperature range of 664 °C-913 °C can be expressed by the following relations: Dc=6.44×10−10 exp[−0.61/(kT)] and Da=2.0×10−8 exp[−0.76/(kT)], where Dc and Da represent diffusion in the silicide film near and away from the surface, respectively.
No takes yet. Share an insight, caveat, or question.
Pelleg et al. (1983) studied this question.
Synapse has enriched 5 related papers. Consider them for comparative context: