Rutherford backscattering spectrometry, X-ray diffraction and scanning electron microscopy were used to study the marker barrier effect in the thermally induced thin film reactions of W/(Ni marker)/Al and Ni/(W marker)/Al structures. The nickel marker did not have a barrier effect in the W/Al reaction, but the tungsten marker did in the Ni/Al reaction. The occurrence of the marker barrier effect is decided by the reaction starting temperatures of aluminum with tungsten and nickel.
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Wang et al. (1992) studied this question.
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