In wafer fabrication, a robotic cluster tool is required to be closed down in order for engineers to perform its on-demand and preventive maintenance and switch between different wafer lots. They often deal with a close-down process subject to wafer residency time constraints, i.e., a wafer must exit from a processing chamber before its quality degradation within a certain time limit. To obtain higher yield, it is very important to optimize a close-down process for a cluster tool. Yet the existing literature pays no or little attention to this issue. By focusing on a time-constrained single-arm cluster tool, this paper intends: 1) to build its Petri net model to analyze its schedulability and 2) to develop computationally efficient algorithms to find an optimal and feasible schedule for its closing-down process under different workloads at its steps. Industrial examples are used to illustrate the application of the proposed method.
No takes yet. Share an insight, caveat, or question.
Zhu et al. (2016) studied this question.
Synapse has enriched 5 closely related papers on similar clinical questions. Consider them for comparative context: