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The paper concerns the problem of SPICE modeling of the merged pin Schottky (MPS) diodes. In the paper, the SPICE electrothermal model (ETM) of the SiC MPS diodes proposed by Infineon Technologies is investigated. The model was verified experimentally by comparing the calculated and the measured d.c. characteristics of the diode IDT06S60C. Some modifications of the model resulting in the improvement of its accuracy at d.c. analysis are proposed.
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Zarębski et al. (2010) studied this question.
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