Computer Simulation of Hybrid Integrated Circuits Including Combined Electrical and Thermal Effects

This paper describes the application of a modern general purpose network analysis programme SPICE2 for the electrothermal analysis of hybrid integrated circuits. Self thermal coupling effects are modelled using the non‐linear dependent current and voltage source capability in this programme, together with thermal environment parameters obtained from a three‐dimensional thermal analysis program. Although numerical results are given by a bipolar transistor, the method is also applicable to monolithic integrated circuits and to resistors with variable temperature coefficients as power dissipating elements.