The influence of microstructure coarsening on thermomechanical fatigue behavior of eutectic solder joint is investigated by numerical simulation. A phase growth model is selected based on the experimental observation and incorporated in a damage mechanics based viscoplastic constitutive model. Comparisons between the simulations with and without coarsening effect are made for isothermal, cyclic shear testing and thermal cycling of solder joints in BGA electronic packaging.
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Tang et al. (2001) studied this question.
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