Electron-beam fabrication of high-density amorphous bubble film devices

A low-temperature, all-vacuum process combined with electron-beam lithography suitable for single-level masking devices using 2-μm diameter amorphous bubble films has been developed. A test vehicle which uses 0.75-μm wide chevrons and 1-μm wide T.I bars in an 8,000- bit chip configuration, resulting in an areal density of 1×107bits/in2, was used. Important process features are found to be: (1) laminated NiFe films to obtain low Hcand high magneto-resistive effect when deposited at low substrate temperature, (2) maintenance of low surface temperature during metallization to preserve the integrity of exposed and developed electron-beam resist pattern, and (3) proper resist profile for ease of the lift-off process. Excellent bubble device operating characteristics have been obtained as a result of uniformity in materials and structure resulting from careful control of fabrication parameters.