This paper describes an integrated-circuit package antenna (ICPA) designed and fabricated using low-temperature cofired ceramic (LTCC) technology for wireless transceivers. The ICPA features a shorting via for frequency-band selection. The measured results show that the prototype ICPA with a size of 17 × 17 × 2 mm3 operates at 5.37 GHz when the via is shorted to ground and at 5.67 GHz when the via is opened. The radiation patterns of the ICPA for both cases are similar to those of a conventional microstrip patch antenna on a small ground plane.
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Wang et al. (2005) studied this question.
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