Wideband characterization of mutual coupling between high density bonding wires

Mutual coupling between grounded bonding wires for high density IC packaging has been characterized over a wide frequency range using the Method of Moments in consideration of the ohmic and radiation losses. At high frequencies, the mutual inductance greatly increases due to the radiation-enhanced mutual coupling effect. For 500-μm-long bonding wires, a minimum 200-μm separation is required to maintain a 20-dB crosstalk level at low frequencies. This wideband analysis will be useful for designing packages and interconnection layouts of high frequency ICs with increased packaging density and operating frequency.