Metallic Cu coating on HTS surfaces using electrochemical preparation

A progress in the Cu/HTS connection at an industrial-like and economical level has been achieved. We report a successful electrochemical deposition method of medium-scale fabrication of 0.5-50 /spl mu/m thin homogeneous Cu films on HTS surfaces. The microstructure of the layer and the interface properties are characterized by SEM and analytical investigations. We measure contact resistivities of Cu on bulk YBCO in the 0.3 /spl mu//spl Omega/cm/sup 2/ range at 77 K and evaluate it with data from microscopy analysis. The fabrication method allows the Cu deposition on all Cu-O-based HTS materials. Cu prevents HTS long-time degradation and surface corrosion. The metallic layer is capable of improving the electrical and thermal properties of I-ITS components to withstand shock, hot spots and short circuit-currents in electrical systems, e.g. current leads and fault current limiters.