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In this paper, silicon-oxide-nitride-oxide-semiconductor (SONOS) devices with embedded silicon nanocrystals (Si-NCs) in silicon nitride using in situ method with multilevel and 2-b/cell operation have been successfully demonstrated. The proposed in situ Si-NC deposition method exhibits the advantages of low cost, simplicity, and compatibility with modern IC processes. SONOS memories with embedded Si-NCs exhibit a significantly improved performance with a large memory window (> 5.5 V), low operating voltage (P/E voltage: Vg= 6 V, Vd= 7 V and Vg= -7 V, Vd= 10 V, respectively), greater tolerable gate and drain disturbance (Vtshifttunder Vg= Vd= 6 V operation), good retention time (> 108s for 13% charge loss), and excellent endurance performance (after 104P/E cycles with a memory window of 3 V).
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Chiang et al. (2010) studied this question.
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