Various middle- and high-permittivity dielectric material systems for LTCC were examined. By designing several borosilicate glass frit systems carefully, we tried to lower the temperature of densification to 875 °C in selected host dielectric materials still maintaining acceptable dielectric properties. The effects of glass addition on the densification, electrical properties, and phase changes in the host dielectric materials were examined.
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Choi et al. (2006) studied this question.
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