Reaction mechanisms between titanium, tantalum, and niobium ethoxides and deuterated water in the atomic layer deposition (ALD) of TiO 2, Ta 2 O 5, and Nb 2 O 5 were studied with a mass spectrometer. The amounts of the reaction product CH 3 CH 2 OD + ( m / z = 47) and its main fragment CH 2 OD + ( m / z = 32) increased up to about 300 °C where all the metal precursors started to thermally decompose. Despite the decomposition, significant amounts of the ligands still remained on the surface and were released in the exchange reactions with D 2 O. It was also observed that in the titanium dioxide process titanium ethoxide adsorbs on the water-treated TiO 2 surface mostly without obvious exchange reactions, and over 90% of the ligands were released during the water pulse. The adsorption of C 2 H 5 OH on the TiO 2 surface was also examined, and it can partially explain the low amount of ligands released during the metal precursor pulses. At 325 °C the ALD growth of Ta 2 O 5 and Nb 2 O 5 can mainly be described as an alternate release of (C 2 H 5 ) 2 O during the Ta(OC 2 H 5 ) 5 or Nb(OC 2 H 5 ) 5 pulses and C 2 H 5 OD during the D 2 O pulse.
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Rahtu et al. (2001) studied this question.
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