Characteristics of DC Reactively Sputtered (Ti,Zr)N Thin Films as Diffusion Barriers for Cu Metallization , Kuo, Yu-Lin, Lee, Chiapyng, Lin, Jing-Cheng, Peng, Chao-Hsien, Chen, Li-Chien, Hsieh, Ching-Hua, Shue, Shau-Lin, Liang, Mong-Song, Daniels, Brian J., Huang, Cheng-Lin, Lai, Chih-Huang
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Kuo et al. (2003) studied this question.
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