Bisphenol A based benzoxazine was prepared from bisphenol A, formaline, and aniline. This benzoxazine was used as a hardener of the epoxy resin. Curing behavior of the epoxy resin and the properties of the cured resin were investigated. Consequently, curing reaction proceeded without a curing accelerator. The molding compound showed good thermal stability under 150°C, which corresponded to the temperature in the cylinder of injection molding. Above 150°C, the curing reaction proceeded rapidly. The cured epoxy resin showed good heat resistance, water resistance, electrical insulation, and mechanical properties compared with the epoxy resin cured by the bisphenol A type novolac.
No takes yet. Share an insight, caveat, or question.
Kimura et al. (1998) studied this question.