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April 1, 1986Journal of The Electrochemical Society

Kinetics of Oxygen Reduction on Sputtered Platinum

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Authors

MWMichael F. WeberMDM. J. DignamSPSu‐Moon Park

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Overview

Comparative electrochemical analysis demonstrates altered kinetics and lower Tafel slopes for oxygen reduction in sputtered platinum films, suggesting an adsorption-controlled reaction near 0.8 V.

Key Points

  • Compare the oxygen reduction kinetics and cyclic voltammetric behavior of sputtered platinum thin films to bulk polycrystalline platinum in alkaline environments.
  • Evaluated sputtered Pt thin films, bulk polycrystalline Pt, and Pt-C thin films across potassium hydroxide (KOH) concentrations from 0.1 to 6.0 M at various temperatures.
  • Measured cyclic voltammetry (CV) responses to track hydrogen adsorption and initial oxide formation peaks, alongside Tafel plots to assess oxygen reduction kinetics.
  • Above 0.85 V (region 1), both bulk and sputtered Pt exhibited dual-slope Tafel plots for oxygen reduction with slopes of approximately 50 mV/decade.
  • Below 0.85 V (region 2), Tafel slopes varied with KOH concentration and temperature but were lower on sputtered Pt, with Pt-C films showing further reduced slopes and no detectable hydrogen adsorption or desorption peaks.
  • The change in Tafel slope near 0.8 V provides direct evidence of an adsorption step governing the oxygen reduction mechanism on the platinum surface.

Cite This Study

Weber et al. (1986) studied this question.

synapsesocial.com/papers/6a86cd2836c36f97809eb70chttps://doi.org/10.1149/1.2108665
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