We report properties of Er2O3 films deposited on silicon using electron-beam gun evaporation. We describe the evolution with thickness and annealing temperature of the morphology, structure, and electrical characteristics. An effective relative dielectric constant in the range of 6–14, a minimum leakage current density of 1–2×10−8 A/cm2 at an electric field of 106 V/cm and breakdown electric field of 0.8–1.7×107 V/cm are demonstrated. Breakdown electric field and leakage current densities are correlated with the surface morphology. The obtained characteristics make the Er2O3 films a promising substitute for SiO2 as an ultrathin gate dielectric.
No takes yet. Share an insight, caveat, or question.
Mikhelashvili et al. (2002) studied this question.
Synapse has enriched 5 closely related papers on similar clinical questions. Consider them for comparative context: