A no‐clean mass reflow process for 396‐pin, 324‐pin and 225‐pin over moulded plastic pad array carriers (OMPACs) or plastic ball grid array (BGA) is presented. Emphasis is placed on the OMPAC assembly parameters such as the design, material and process of the packages and printed circuit board (PCB), solder paste, stencil design, printing technology, pick and place, mass re‐flow and inspection. Furthermore, cross‐sections and the ‘popcorn’ effect of the OMPAC assembly are provided and discussed.
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Lau et al. (1994) studied this question.
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