We demonstrate a low-threshold AlInGaN/InGaN/ GaN metal–oxide semiconductor double heterostructure field-effect transistor (MOS-DHFET) for high-frequency operation. A combination of an InGaN channel (for carrier confinement), a DRE process, and a new digital–oxide-deposition technique helped us to achieve MOS-DHFET devices with extremely low subthreshold leakage currents. This reduction in output conductance (short channel effect) resulted in a high cutoff gain frequencyfTof about 65 GHz and a current gain frequencyf_ maxof 94 GHz. The devices exhibited high drain–currents of 1.3 A/mm and delivered RF powers of 3.1 W/mm at 26 GHz with a 35 V drain bias.
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Adivarahan et al. (2008) studied this question.
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