A new method, for solid‐state bonding between ceramics and metals was developed. An interlayer, which is a composite of the materials to be bonded, is used. The technique can be applied to materials which cannot be bonded by conventional diffusion‐bonding methods because of thermal‐expansion mismatches. It is ex pecked that the bonded materials will have excellent thermal shock resistance .
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Suganuma et al. (1983) studied this question.
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