Wireless interchip communication between adjacent ICs in extreme conditions of orthogonal antennas is studied. The use of soft/hard surfaces and symmetrical layers concepts is employed in a 1:2 wireless interchip communication link to improve the overall link budget. A Y-shaped 1:2 wireless interchip link is fabricated and tested. The simulated results are validated by measurements.
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Al-Alem et al. (2019) studied this question.
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