High current density measurements on giant magnetoresistive NiFe-Cu-NiFe-FeMn spin-valve devices are presented. The spin-valve magnetoresistive response, /spl Delta/R/R, is highly temperature dependent; at temperatures near the blocking temperature there is a considerable reduction of pinning field and decrease in device response. It is desirable to measure certain high current density effects such as electromigration and self-field effects separately from the effects of ohmic heating. For this purpose, we introduce pulsed current techniques necessary to reduce ohmic heating in wafer-level device measurements and we deduce a required pulse width of 15 ns to minimize device heating.
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Kos et al. (1997) studied this question.
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