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April 1, 1992Review of Scientific Instruments

Substrate temperature measurements using ultrasonically bonded Platinel II thermocouples

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Authors

AWA. C. WesterheimON Semiconductor (United States)AAAlfredo C. AndersonMIT Lincoln LaboratoryMCMichael J. CimaMassachusetts Institute of Technology

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Westerheim et al. (1992) studied this question.

synapsesocial.com/papers/6a883fc1b0d802598bf4e3eehttps://doi.org/10.1063/1.1143151
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