Electrical resistance of nickel films of the thickness from 140Å to 1600Å is measured as a function of temperature, and the Curie temperature of the films is determined from a break in resistance vs temperature curve. Residual gas is found to be effective in reducing the Curie temperature of the films when the ratio of pressure to deposition rate exceeds 1×10 -6 mmHg·Å -1 ·sec. A slight decrease of the Curie temperature is observed as a film thickness is decreased.
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Nobuyoshi Morita (1962) studied this question.
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