An analysis of the plasma front velocities during turnoff of a power diode is used to explain the differences between the formation and the behavior of cathode-side and anode-side filaments. Device simulations show, how cathode-side filaments may trigger a thermal runaway at the end of a reverse-recovery period of diodes turned off with extremely high current rates operating the diode in a regime far away from the safe operating area. From the transient voltage curve, the analysis of the reverse-recovery charge as a function of the dc-link voltage and an analysis of the turnoff transients in the current-voltage phase space, it is, however, deduced that the appearance of a cathode-side filament by itself does not necessarily lead to diode destruction. The transformation of the initially avalanche-generated filaments into filaments that are essentially driven by thermal mechanism seems to be a further important condition for device destruction.
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Baburske et al. (2013) studied this question.
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