Two resveratrol-based monomers with thermo-cross-linkable trifluorovinyl-ether groups (−OCF═CF 2 ) have been designed and synthesized. After treating at a temperature above 140 °C, the monomers were converted into cross-linked networks, which display the average dielectric constants ( D k ) of 2.45–2.52 and the average dielectric loss ( D f ) of 2.2 × 10 –3 to 2.6 × 10 –3 at a high frequency of 5 GHz. Such data are much better than these of the resveratrol-based epoxy resin ( D k of above 3.5 and D f of near 2.6 × 10 –2 ) and the commercial bisphenol A epoxy resins ( D k of above 3.7). In addition, two cured monomers exhibit high thermostability with a 5% weight loss temperature ( T 5d ) of more than 450 °C. They also display low water uptake of below 0.08% when immersed in boiling water for 3 days. These data indicate that the resveratrol-based monomers in this contribution are suitable as the encapsulation resins for the application in the microelectronic industry.
No takes yet. Share an insight, caveat, or question.
Fang et al. (2020) studied this question.
Synapse has enriched 5 closely related papers on similar clinical questions. Consider them for comparative context: