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The authors introduced an effective approach of using monolayer-protected silver nanoparticles to reduce silver migration for electronic device interconnect applications. Formation of surface complex between the carboxylate anion and surface silver ion reduces the solubility and diffusivity significantly of migration components and therefore contributes to effective migration control. A fundamental understanding of the mechanism of silver migration control was conducted by studying the current-voltage relationships of the nanocomposites with a migration model. The control of silver migration enables the application of the silver composites in fine pitch and high performance electronic device interconnects.
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Li et al. (2006) studied this question.
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