Atomic scale saw by dislocation slipping: A new method to generate one-dimensional structure

A new method to generate one-dimensional (1D) semiconductor structures or controllable steps on a surface is proposed. This method, which is not material specific, is based on intrinsic dislocation slip properties and heterogeneity of straining. Dislocations can be used as an atomic scale saw to cut two-dimensional structures (2D) in order to obtain 1D wires. Atomic force microscope observations of GaAs surfaces and transmission electronic microscopy cross sections of GaAs/GaAlAs single quantum wells are presented to demonstrate the feasibility of the method. Although being based on dislocation slipping this method is shown to preserve the optical and crystalline properties of the starting 2D structure as confirmed by photoluminescence spectra.