Review demonstrates dimensional engineering strategies for carbon-based hybrids across GHz to THz bands, highlighting pathways toward lightweight, broadband microwave absorbers.
The escalating electromagnetic interference (EMI) from GHz to THz frequencies necessitates advanced electromagnetic wave absorbing materials (EWAMs). This review explores dimensional architecture engineering to overcome the trade-off between impedance matching and attenuation. We analyze 1D carbon nanofibers for conductivity, two-dimensional MXenes for interfacial polarization, and 3D MOF-derived frameworks for multiple scattering. Emphasis is placed on multidimensional hybrids (e.g., 1D/2D, 2D/3D) that synergistically enhance performance beyond single-dimensional limits. Critical challenges like environmental stability, scalability, and standardized testing are addressed. Finally, we propose future directions including dynamic tunability, multifunctional integration, and AI-driven design, offering a robust framework for next-generation intelligent EWAMs achieving thin, lightweight, broadband, and strong absorption.
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LIU et al. (2026) studied this question.
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