Wetting‐Driven Transfer of Flexible Ultra‐Thin Temperature Sensors

Transferable temperature sensors that maintain reliable performance across heterogeneous interfaces are increasingly important for next‐generation soft and unconventional electronics. However, conventional transfer methods based on sacrificial‐layer dissolution limit material compatibility and device reliability, particularly on non‐planar and environmentally dynamic surfaces. Here, a wetting‐driven transfer strategy is presented for resistive temperature detectors (RTDs) and thermistors based on zinc (Zn), copper (Cu), and amorphous indium gallium zinc oxide (IGZO). The wetting‐controlled delamination enables a clean release from a superhydrophilic donor substrate without the need for sacrificial layers or etching steps, avoiding complex release procedures. A conformal Parylene carrier layer preserves the integrity of water‐sensitive materials while providing mechanical support, thus enabling transfer from a super‐hydrophilic donor substrate onto biological receiver substrates, including leaves and gastropod shells. The transferred devices exhibit stable resistance‐temperature behavior with minimal variation after transfer, demonstrating reliable operation across flat, curved, and irregular surfaces. In addition, the sensors operate in floating‐on‐water configurations, highlighting the mechanical compliance and robustness of the ultrathin structures. Overall, this work establishes a scalable, material‐compatible platform for integrating flexible temperature sensors onto unconventional surfaces, thereby expanding the applicability of soft electronics to dynamic and environmentally diverse systems.