Alignment of 1D assemblies of a wide variety of nanoparticles (e.g., metal, metal oxide, semiconductor quantum dots, or organic microspheres) in one direction upon diverse substrates (including industrial silicon wafers and transparent glass plates) by a general strategy is demonstrated. This sandwich method provides an efficient way of rapidly and precisely assembling nanoparticles on a large scale (up to 10 cm × 10 cm) for device applications.
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Su et al. (2014) studied this question.
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