Answers are grounded in this paper and cite their sources.
The bonding of a monolithic array of surface-emitting microlasers onto a glass substrate that contains a matching array of microlenses and mirrors is reported. The bonding was achieved by flip-chip solder bump bonding using indium as the solder material. The alignment precision is within +or-2 mu m. The optical substrate provides a simple interconnection scheme that routes the light from each laser to well defined output positions.>
No takes yet. Share an insight, caveat, or question.
Jahns et al. (1992) studied this question.
Synapse has enriched 10 related papers. Consider them for comparative context: