Three-dimensional analysis of a heat-spreading phenomenon in a heat sink of phase-locked arrays of oxide-isolated diode lasers is carried out in the present paper. The main result is that with increasing number of laser elements the heat-sink temperature increase turns out to change sublinearly whereas temperature differences between adjacent edge lasers increase considerably which threatens stability of the phase-locking operation. The heat spreading in semiconductor, contact, and solder layers was approximated by a one-dimensional model. The special correction factor (b) accounting for the two dimensionality of this heat spreading was used to improve the accuracy of the calculations.
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W. Nakwaski (1990) studied this question.
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