Measurements have been made of the lattice thermal conductivities of six polycrystalline and two single crystal specimens of copper‐aluminium alloys in the temperature range 1.5 to 4.2 °K. The aluminium content varied from 2 to 12 at.% giving rise to residual electrical resistivities between 2 and 8 μΩ cm. The lattice thermal conductivities varied as T2 with small contributions, linear in temperature, which may arise from grain boundaries. The results are compared with the model for ultrasonic attenuation by free electrons due to Pippard.
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Charsley et al. (1965) studied this question.
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