We demonstrate a technique to reduce the extended defect densities in a-plane GaN deposited on r-plane sapphire. The SiO2 lateral epitaxial overgrowth mask consisted of ⟨11¯00⟩GaN stripes. Both the mask and GaN were etched through the mask openings and the lateral growth was initiated from the etched c-plane GaN sidewalls, and the material was grown over the mask regions until a smooth coalesced film was achieved. Threading dislocation densities in the range of 106–107cm−2 were realized throughout the film surface. The on-axis and off-axis full width at half maximum value and surface roughness were 0.082°, 0.114°, and 0.622 nm, respectively.
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Imer et al. (2006) studied this question.
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