Effects of low-temperature Si buffer layer thickness on the growth of SiGe by molecular beam epitaxy

The thickness of a low-temperature silicon (LT-Si) buffer layer has been found to affect the growth of a SiGe overlayer significantly. 300-nm-thick Si0.7Ge0.3 films were grown on 50- to 300-nm-thick LT-Si buffer layers at 450 °C by solid-source molecular beam epitaxy. The threading dislocation density was found to decrease with the thickness of the LT-Si buffer in the thickness range of 50–200 nm. The density remains at the same low level when the thickness was increased from 200 to 300 nm. A relatively dense misfit dislocation network was observed to form at the SiGe/Si interface in samples with the LT-Si buffer layer thickness exceeding 200 nm. It is suggested that the presence of more point defects in the thicker LT-Si buffer layer is more effective to block the propagation of threading dislocations.