Gray-tone lithography using an optical diffuser and a contact aligner

This paper describes a simple method for the three-dimensional (3D) microfabrication of complex high-aspect structures in a one mask lithography process. The method relies on an unconventional way of performing gray-tone lithography. The main idea is to randomize the collimated light by using an optical diffuser to generate intensity distributions in the photoresist. The resist topography is determined by the density of open and opaque squares in the photomask. The resulting 3D resist is then transferred into 3D silicon structures by using reactive ion etching and deep reactive ion etching.