The silicon carbide (SiC) super-junction JFET was designed, simulated and fabricated through trench-etching and sidewall-implantation technology, which avoids the expensive epi-regrowth process. The fabricated super-junction JFET achieves a breakdown voltage of 1000V with specific on-resistance of 1.3mΩ ·cm2. The threshold voltage (Vth) is stable over a wide range of temperature with less than 0.2V shift from 25°C to 175°C. These results demonstrate that the trench-etching and sidewall-implantation technology is a promising option to fabricate SiC super-junction devices. These devices could have great potential for future power electronics.
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Wang et al. (2020) studied this question.
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