High-aspect ratio submicrometer needles for intracellular applications

Presented is a processing technology to produce high aspect ratio submicrometer needles.This processing technique is required to create single or arrays of needles suited for intracellular interfacing.Pillars are created using deep reactive ion etching.The sharpening of the pillars is achieved by reactive ion etching.200-300 µm tall needles with a 200 nm wide tip have been produced.Integration with flexible electrical interconnects is described.