A unified hybrid-mode analysis is presented for determining the propagation characteristics of multiconductor, multilayer planar transmission lines. The analysis employs the conservation of complex power technique, and the emphasis is on numerical efficiency and simplicity. Numerical results, for finline and microstrip configurations, aim at the clarification of the effects of the metalization thickness, dielectric anisotropy, and substrate mounting grooves.
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Mansour et al. (1987) studied this question.
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