Dislocations generated by localized diffusions in silicon are investigated through x-ray diffraction microscopy. It is shown that dislocations are produced at the interface of diffused and undiffused silicon as a consequence of elastic strains resulting most likely from steep lattice-constant gradients. From the device point of view these dislocations are undesirable because their axes lie outside the diffusion plane; consequently they can cause device failure.
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Schwuttke et al. (1966) studied this question.
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