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Simulation study demonstrates improved thermal dissipation and reduced pressure drop in perforated pin-fin heat sinks, highlighting efficient cooling strategies for microelectronics.
This research focuses on heat sinks with perforated pin fins of cylindrical, rectangular, and conical shapes to meet the thermal demands of rapidly evolving electronics. Heat transfer performance of perforated fins (Np = 1–5) under a range of Reynolds numbers (Re = 8547–21,367) was examined by COMSOL Multiphysics and a k‐ε turbulence model. The findings indicate that all perforated fins outperform solid fins, with a hydrothermal performance factor (HTPF) > 1. The rectangular fin shows a good performance when Np = 5, boosting the Nusselt number (Nu) by 27% while reducing the pressure drop (Δ p ) by 46% at Re = 21,367, and attains a maximum HTPF of 1.45. On the other hand, the cylindrical fin performs best at Np = 2, with HTPF = 1.43, yielding an equivalent advantage. The conical fins achieve the maximum heat transfer, raising Nu by 35% at Np = 3, but also increasing Δp by 4.8% compared with the other two shapes. The number of holes varies by the best option for each: rectangular fins require more perforations; cylindrical fins are better with fewer perforations; but conical fins prioritize heat transfer, even if they cause greater flow resistance. These results suggest that proper perforations can not only enhance heat dissipation but also reduce material usage, hence making perforated pin fins a promising solution for cooling microelectronics and heat management in power systems.
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Bellahcene et al. (2026) studied this question.
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