We studied the surface properties of patterned Al(Cu) lines related to the electromigration phenomena using photoemission spectromicroscopy techniques. We stressed the lines for electromigration in situ in the ultrahigh vacuum microscope chamber and observed the changes on the line surface. Our results show surface precipitation of Cu beneath the Al2O3 layer on the line surface as well as on side walls. Enrichment of grain boundaries in Cu due to electromigration flux was observed in areas downstream of voids with respect to the electron flow.
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Solak et al. (1999) studied this question.
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