Conductive core–shell particles consisting of a dielectric core and a metallic shell were prepared using layer‐by‐layer assembly and electroless plating. Conductivity was studied using X‐ray photoelectron spectroscopy and UV‐vis spectroscopy as a function of the preparation protocol. Routines for the controlled self‐assembly of these particles into continuous lines (see Figure and cover) were investigated to explore their applicability in self‐assembled mesoscopic wiring.
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Kaltenpoth et al. (2003) studied this question.
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