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In this letter, the authors investigate the strain induced by titanium nitride (TiN) electrode and effective work function (EWF) tuning for metal-oxide-semiconductor field effect transistors (MOSFETs). Scaling of TiN thickness was found to be effective both in increasing tensile stress on Si substrates and in lowering the EWF of metal gate n-MOSFETs. The device with 3nm TiN as a gate electrode showed favorable threshold voltage (Vth) for n-MOSFETs as well as higher channel electron mobility by 17% compared to the device with 20nm TiN film.
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Kang et al. (2007) studied this question.
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