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A rotary multiple-filament turret is described which permits sequential vapor deposition of several materials from the same position within a vacuum chamber, thereby eliminating angle-of-incidence problems at the receiving surface of the substrate. No dynamic feed-throughs are used in the system, and only one high-current feed-through is used, thus minimizing high-vacuum leaks.
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Simmons et al. (1962) studied this question.
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